Patent attributes
A manufacturing method of chips from a workpiece including plural planned dividing lines on a front surface includes a cutting step of causing a cutting blade to cut into the workpiece for which a side of the front surface of the workpiece is held by a holding table in such a manner that a side of a back surface of the workpiece is exposed and forming a cut groove that does not reach the front surface of the workpiece on the side of the back surface of the workpiece along each planned dividing line, a sticking step of sticking an expanding sheet to the workpiece, and a dividing step of dividing the workpiece along each planned dividing line by expanding the expanding sheet to form the chips from the workpiece after the sticking step and the cutting step.
