US Patent 11189534 Semiconductor assembly and deterioration detection method

A semiconductor assembly is provided, that includes a semiconductor chip including an upper surface electrode and a lower surface electrode opposite to the upper surface electrode, a metallic wiring plate electrically connected to the semiconductor chip, and a soldering portion that bonds the upper surface electrode of the semiconductor chip to the metallic wiring plate by soldering, the semiconductor chip including a temperature detection portion, an anode wire for the temperature detection portion, and a first insulation layer that blocks the soldering portion and insulates the soldering portion from the anode wire. A deterioration detection method for a semiconductor module is provided, that includes a semiconductor assembly, the deterioration detection method including monitoring a temperature of a temperature detection portion disposed in a semiconductor chip, and detecting a temperature anomaly based on short circuit of an anode wire disposed in the semiconductor chip to detect deterioration of the semiconductor module.