US Patent 11189541 Semiconductor package

A semiconductor package includes a substrate, an electronic component mounted on an upper surface of the substrate so that a lower surface of the electronic component faces the upper surface of the substrate, a heat slug disposed on an upper surface of the electronic component so that a lower surface of the heat slug faces the upper surface of the electronic component, a bonding material bonding the heat slug to the upper surface of the electronic component, and an encapsulant in which the heat slug and the electronic component are embedded. A side surface of the heat slug extending between an edge of the lower surface of the heat slug and an edge of an upper surface of the heat slug forms a recess with the upper surface of the electronic component.