Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Nishant Lakhera0
Akhilesh Kumar Singh0
Chee Seng Foong0
Date of Patent
November 30, 2021
0Patent Application Number
167918170
Date Filed
February 14, 2020
0Patent Primary Examiner
Patent abstract
A method of manufacturing a hybrid package including a flat package and a Wafer Level Chip Scale Package (WLCSP) is disclosed. The method includes fabricating a strip including a plurality of flat packages attached to each other via metal pins, turning the strip upside down, applying a layer of a thermal interface material (TIM) on each of the flat packages while the each of the flat packages is turned upside down, mounting the WLCSP on the layer of the TIM such that a top side of the WLCSP is interfaced with the layer of the TIM, curing the layer of the TIM and singulating each of the flat packages by cutting the metal pins and bending the metal pins.
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