Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Pyung Hwa Han0
Won Choi0
Sung Hawn Bae0
Jung Soo Kim0
Date of Patent
November 30, 2021
0Patent Application Number
165802400
Date Filed
September 24, 2019
0Patent Primary Examiner
Patent abstract
A semiconductor package includes: a connection structure having first and second surfaces opposing each other and including a redistribution layer; a semiconductor chip disposed on the first surface of the connection structure and having connection pads connected to the redistribution layer; an encapsulant disposed on the first surface of the connection structure, encapsulating the semiconductor chip, and including an opaque or translucent resin; a mark indicating identification information and carved in the encapsulant; and a passivation layer disposed on the encapsulant and including a transparent resin.
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