The invention is a polymer composition for film layer comprising less than 50 wt % of a copolymer of ethylene with silane group(s) containing units and at least 50 wt % of a thermoplastic polyolefine free from silane group(s) wherein the polymer composition has creep of less than 1 mm at 90° C., and an adhesion above 20 N/cm. The invention relates to a laminated article with at least one film layer of the polymer composition and a substrate.