US Patent 11197990 Systems and methods for transcutaneous power transfer using microneedles

A system for supplying power transcutaneously to an implantable device implanted within a subject is provided. The system includes an external connector including one of a microneedle array and a microwire holder. The system further includes a power cable electrically coupled to the external connector and configured to supply power to the one of the microneedle array and the microwire holder, and an internal connector configured to be implanted within the subject and electrically coupled to the implantable device, the internal connector including the other of the microneedle array and the microwire holder. The microneedle array includes a plurality of electrically conductive microneedles, the microwire holder includes a plurality of electrical contacts, and the microwire holder is configured to engage the microneedle array such that the plurality of electrically conductive microneedles extend through the skin of the subject and electrically couple to the plurality of electrical contacts.