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Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
December 14, 2021
Patent Application Number
15976725
Date Filed
May 10, 2018
Patent Citations Received
Patent Primary Examiner
Patent abstract
Techniques for integrating two-phase cooling into a microprocessor chip package lid are provided. In one aspect, a vapor chamber lid device includes: an evaporator plate; a condenser plate attached to the evaporator plate such that a cavity is formed between the evaporator plate and the condenser plate; a thermal insulation layer sandwiched between the evaporator plate and the condenser plate; and a working fluid enclosed within the cavity, wherein the working fluid partially fills the cavity. At least one heat-dissipating device can be placed in thermal contact with the evaporator plate via a thermal interface material. A method is also provided for forming the vapor chamber lid device.
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