US Patent 11211250 Laminated element manufacturing method
Patent 11211250 was granted and assigned to Hamamatsu Photonics on December, 2021 by the United States Patent and Trademark Office.
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A laminated element manufacturing method includes a first forming step of forming a first modified region along a line to cut by irradiating a semiconductor substrate of a first wafer with a laser light along the line to cut, a first grinding step of grinding the semiconductor substrate of the first wafer, a bonding step of bonding a circuit layer of a second wafer to the semiconductor substrate of the first wafer, a second forming step of forming a second modified region along the line to cut by irradiating a semiconductor substrate of the second wafer with a laser light along the line to cut, and a second grinding step of grinding the semiconductor substrate of the second wafer.
US Patent 11211250 Laminated element manufacturing method
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