US Patent 11222850 Electronic package with rotated semiconductor die
Is a
Date Filed
April 12, 2020
0
Date of Patent
January 11, 2022
0
Patent Application Number
16846381
0
Patent Citations Received
Patent Inventor Names
I-Hsuan Peng
0
Yi-Jou Lin
0
Chih-Jung Hsu
0
Yao-Chun Su
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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