Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Joseph Seeger0
Ting-Yuan Liu0
Pei-Wen Yen0
Calin Miclaus0
Chung-Hsien Lin0
Jye Ren0
Date of Patent
January 18, 2022
0Patent Application Number
165740370
Date Filed
September 17, 2019
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A device includes a microelectromechanical system (MEMS) sensor die comprising a deformable membrane, a MEMS heating element, and a substrate. The MEMS heating element is integrated within a same layer and a same plane as the deformable membrane. The MEMS heating element surrounds the deformable membrane and is separated from the deformable membrane through a trench. The MEMS heating element is configured to generate heat to heat up the deformable membrane. The substrate is coupled to the deformable membrane.
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