Is a
Patent attributes
Patent Applicant
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hoang Dinh Do0
Robert Howard Boutier, Jr.0
Date of Patent
January 18, 2022
Patent Application Number
14928189
Date Filed
October 30, 2015
Patent Citations Received
Patent Primary Examiner
Patent abstract
According to various aspects, exemplary embodiments are disclosed of thermally-conductive EMI absorbers that generally includes thermally-conductive particles, EMI absorbing particles, and silicon carbide. The silicon carbide is present in an amount sufficient to synergistically enhance thermal conductivity and/or EMI absorption. By way of example, an exemplary embodiment of a thermally-conductive EMI absorber may include silicon carbide, magnetic flakes, manganese zinc ferrite, alumina, and carbonyl iron.
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