US Patent 11240910 Heat dissipation structure and electronic device

A heat dissipation structure applied to an electronic device includes a circuit board assembly, a pipe, a refrigerant fluid, and a water pump. The circuit board assembly is provided with a receiving chamber therein, an inlet, and an outlet. Each of the inlet and the outlet communicates with the receiving chamber. The pipe and the receiving chamber together form a liquid channel. The refrigerant fluid is received in the liquid channel. The water pump communicates with the pipe and is configured to circulate the refrigerant fluid in the liquid channel to remove heat from the circuit board assembly.