Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Jiewen Yao0
Vincent Zimmer0
Date of Patent
February 15, 2022
0Patent Application Number
166499110
Date Filed
September 27, 2017
0Patent Citations
Patent Citations Received
Patent Primary Examiner
Patent abstract
An embodiment of a semiconductor package apparatus may include technology to determine version information for a new firmware component, read dependency information corresponding to the firmware component, and determine if dependency is satisfied between the new firmware component and one or more other firmware components based on the version information and the dependency information of the new firmware component. Other embodiments are disclosed and claimed.
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