Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Robert J. Munoz0
Thomas P. Thomas0
John Mark Matson0
Kursad Kiziloglu0
Michael Rifani0
Date of Patent
February 15, 2022
0Patent Application Number
160078670
Date Filed
June 13, 2018
0Patent Citations Received
Patent Primary Examiner
Patent abstract
Embodiments may relate to a substrate for use in a system in package (SIP). The substrate may include a first couple to couple with a first component via a permanent couple such that the first component is communicatively coupled with a bridge. The substrate may further include a second couple to removably couple with an interposer such that the interposer is communicatively coupled with the bridge via a communicative couple. Other embodiments may be described or claimed.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
