US Patent 11252840 Vapor cooling of electronics

A cooling assembly according to various aspects of the present disclosure includes a housing, an electronic component, a dielectric coolant, and a cover. The housing includes an interior compartment having a basin region in which the electronic component and the coolant are disposed. The coolant undergoes phase change between a liquid state and a gas state. The coolant is in direct contact with the electronic component in the liquid state. The cover component extends transversely through the interior compartment and is coupled to the body. The cover component is disposed in a direction with respect to the basin region. The cover component at least partially defines a port in fluid communication with the basin region. The cover component is configured to permit flow therethrough of the dielectric coolant in the gas state in at least the direction.