US Patent 11256029 Photonics packaging method and device

Photonic packages are described. One such photonic package includes a photonic chip, an application specific integrated circuit, and optionally, an interposer. The photonic chip includes photonic microelectromechanical system (MEMS) devices. A photonic package may include a material layer patterned to include recesses. The recesses are aligned with the photonic MEMS devices so as to form enclosed cavities around the photonic MEMS devices. This arrangement preserves the integrity of the photonic MEMS devices.