Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Takehiro Tanikawa0
Date of Patent
February 22, 2022
Patent Application Number
16394320
Date Filed
April 25, 2019
Patent Citations Received
Patent Primary Examiner
Patent abstract
There is provision of a substrate processing apparatus including an inner edge ring provided in a vicinity of a substrate to be placed on a stage in a processing chamber; a middle edge ring arranged outside the inner edge ring, the middle edge ring being configured to be moved vertically by an actuation mechanism; an outer edge ring arranged outside the middle edge ring; a first spring provided between the inner edge ring and the middle edge ring; and a second spring provided between the middle edge ring and the outer edge ring.
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