Is a
Patent attributes
Patent Applicant
Patent Jurisdiction
Patent Number
Patent Inventor Names
Bongken Yu0
Date of Patent
February 22, 2022
0Patent Application Number
168143360
Date Filed
March 10, 2020
0Patent Primary Examiner
Patent abstract
A semiconductor package includes a package substrate, a logic chip on an upper surface of the package substrate and electrically connected to the package substrate, a heat sink contacting an upper surface of the logic chip to dissipate a heat generating from the logic chip, and a memory chip disposed on an upper surface of the heat sink and electrically connected to the package substrate.
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