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US Patent 11257926 Self-aligned contact structures
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Patent
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Date Filed
June 8, 2020
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Date of Patent
February 22, 2022
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Patent Application Number
16895604
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Patent Citations
US Patent 10163691 Low-K dielectric interconnect systems
US Patent 10170322 Atomic layer deposition based process for contact barrier layer
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Patent Inventor Names
Yu-Ming Lin
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Chih-Hao Wang
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Li-Zhen Yu
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Lin-Yu Huang
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Cheng-Chi Chuang
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Chia-Hao Chang
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11257926
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Patent Primary Examiner
Zandra V. Smith
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