Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
So Young Kim0
Jung Sup Shim0
Se Woo Yang0
Seung Min Lee0
Date of Patent
March 8, 2022
0Patent Application Number
155600420
Date Filed
March 24, 2016
0Patent Primary Examiner
Patent abstract
Provided are an adhesive composition and an organic electronic device (OED) including the same, and more particularly, an adhesive composition, which may form an encapsulation structure effectively blocking moisture or oxygen flowing into an OED from the outside, thereby ensuring the lifespan of the OED, and facilitates coating in the process of forming the encapsulation structure of the OED, thereby preventing the problem of flow of bubbles into the encapsulation structure or blocking of a coating nozzle and thus enhancing processability, and an OED including the same.
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