Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Li Yao0
Cheng Yang0
Dongkai Shangguan0
Date of Patent
March 8, 2022
0Patent Application Number
167097500
Date Filed
December 10, 2019
0Patent Citations
Patent Primary Examiner
Patent abstract
An electronic component and a method of manufacturing an electronic component, the method including surface mounting electronic components to a printed circuit board (PCB), applying a flip-chip die integrated circuit (IC) to the PCB and underfilling the flip-chip IC to secure the PCB. The method also includes sintering a copper block to the PCB, where the copper block is in thermal communication with the IC and acts as a thermal path for removing heat generated by the flip-chip IC.
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