US Patent 11275110 Semiconductor package with predictive safety guard

The disclosure describes techniques for detecting failures or performance degradation of a device including an integrated circuit (IC) components in the field by including additional contacts, i.e. terminals, along with functional contacts of the circuit used for connecting the circuit to a system in which the circuit is a part. These additional contacts may be internal external to the package surface and may be used to measure dynamic changing electrical characteristics over time e.g. voltage, current, capacity, temperature and impedance. These electrical characteristics may be representative of one or more failure modes and may be treated as indicator for device state-of-health (SOH).