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US Patent 11276724 Electrical interconnection of image sensor package
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Patent
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Date Filed
June 27, 2019
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Date of Patent
March 15, 2022
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Patent Application Number
16455676
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Patent Citations
US Patent 10418396 Stacked image sensor package
Patent Inventor Names
Shou-Chian Hsu
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11276724
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Patent Primary Examiner
Lex H Malsawma
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CPC Code
H01L 27/14687
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H01L 27/14636
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H01L 27/14618
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H01L 2224/13147
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H01L 2224/13024
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H01L 24/13
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