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US Patent 11277937 Re-entrant flow cold plate

Patent 11277937 was granted and assigned to Jetcool on March, 2022 by the United States Patent and Trademark Office.

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Edits on 31 Oct, 2024
"update inverses"
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Golden AI
edited on 31 Oct, 2024
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Infobox (+1 properties)
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Patent Citations Received
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US Patent 12133365 Cooling system and methods
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Edits on 16 Oct, 2024
"update inverses"
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Golden AI
edited on 16 Oct, 2024
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Patent Citations Received
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US Patent 12119438 Thermal management system for electrically-powered devices
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Edits on 21 Jul, 2023
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Golden AI
edited on 21 Jul, 2023
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=1127793700
Edits on 27 Apr, 2023
"Entity importer update"
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Golden AI
edited on 27 Apr, 2023
Infobox
Is a
Patent
Patent
0
Patent Applicant
Jetcool
Jetcool
0
Current Assignee
Jetcool
Jetcool
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
112779370
Date of Patent
March 15, 2022
0
Patent Application Number
169433250
Date Filed
July 30, 2020
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=112779370
Patent Citations
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US Patent 10228735 Methods of direct cooling of packaged devices and structures formed thereby
0
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US Patent 10985089 Semiconductor cooling arrangement
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Patent Primary Examiner
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Anatoly Vortman
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CPC Code
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H05K 7/20281
0
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H05K 7/20272
0
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H05K 7/20263
0
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H05K 7/20254
0
Edits on 29 Mar, 2023
"update citations for inverse infoboxes"
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Golden AI
edited on 29 Mar, 2023
Edits on 26 Mar, 2023
"update citations for inverse infoboxes"
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Golden AI
edited on 26 Mar, 2023
Edits on 25 Sep, 2022
"Entity importer update"
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Golden AI
edited on 25 Sep, 2022
Infobox
Is a
Patent
Patent
0
Patent Applicant
Jetcool
Jetcool
0
Current Assignee
Jetcool
Jetcool
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
112779370
Date of Patent
March 15, 2022
0
Patent Application Number
169433250
Date Filed
July 30, 2020
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=112779370
Patent Citations
‌
US Patent 10228735 Methods of direct cooling of packaged devices and structures formed thereby
0
‌
US Patent 10985089 Semiconductor cooling arrangement
0
Patent Primary Examiner
‌
Anatoly Vortman
0
CPC Code
‌
H05K 7/20281
0
‌
H05K 7/20272
0
‌
H05K 7/20263
0
‌
H05K 7/20254
0
Edits on 25 Sep, 2022
"update citations for inverse infoboxes"
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Golden AI
edited on 25 Sep, 2022
Edits on 6 Jun, 2022
"Entity importer update"
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Golden AI
edited on 6 Jun, 2022
Edits made to:
Infobox (+1 properties)
Infobox
Website URL
https://pdfpiw.uspto.gov/.piw?Docid=11277937
Edits on 19 Mar, 2022
"Entity importer update"
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Golden AI
edited on 19 Mar, 2022
Edits made to:
Infobox (+4 properties)
Article (+344 characters)
Article

A fluid-cooled re-entrant cold plate for thermal management of heat dissipating electronic devices or assemblies. The fluid leaves the cold plate's outer perimeter, fills a sealed cavity between the cold plate outer perimeter and the mating component/assembly, provides direct cooling of the electronic component, then re-enters the cold plate.

Infobox
CPC Code
‌
H05K 7/20281
‌
H05K 7/20272
‌
H05K 7/20263
‌
H05K 7/20254
Edits on 16 Mar, 2022
"Created via: Entity Importer"
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Golden AI
created this topic on 16 Mar, 2022
Edits made to:
Infobox (+11 properties)
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 US Patent 11277937 Re-entrant flow cold plate

Infobox
Is a
Patent
Patent
Patent applicant
Jetcool
Jetcool
Current assignee
Jetcool
Jetcool
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
11277937
Date of patent
March 15, 2022
Patent application number
16943325
Date Filed
July 30, 2020
Patent citations
‌
US Patent 10228735 Methods of direct cooling of packaged devices and structures formed thereby
‌
US Patent 10985089 Semiconductor cooling arrangement
Patent primary examiner
‌
Anatoly Vortman

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