Patent 11289406 was granted and assigned to Allegro Microsystems, Llc on March, 2022 by the United States Patent and Trademark Office.
Methods and apparatus for a signal isolator having enhanced creepage characteristics. In embodiments, a signal isolator IC package comprises a leadframe including a die paddle having a first surface to support a die and an exposed second surface. A die is supported by a die paddle wherein a width of the second surface of the die paddle is less than a width of the die.