Patent attributes
A radio-frequency module includes a multilayer circuit board, a plurality of components mounted on a top surface of the multilayer circuit board, a sealing resin layer laminated on the top surface of the multilayer circuit board and sealing a plurality of components, and a shield wall disposed in a groove formed in the sealing resin layer between the component and the component. The shield wall has a region that overlaps the component when viewed in a direction perpendicular to the top surface of the multilayer circuit board. The groove in the overlapped region is formed with a depth that does not reach the component. In the component, a terminal electrode that covers the entire surfaces of side surfaces, and part of a top surface, a bottom surface, and side surfaces is formed.
