Patent attributes
In one embodiment, an electronics enclosure for housing a data processing system includes a number of enclosure panels forming a fully enclosed container to contain electronics, including a first enclosure panel having a liquid cooling component therein and a second enclosure panel having an air cooling component therein. The enclosure is thermally managed by implementing these panels. The first enclosure panel includes an inlet port to receive cooling liquid from an external cooling liquid source, a cooling plate disposed on an inner surface of the first enclosure panel to receive a motherboard of the data processing system and to extract heat from the motherboard using the cooling liquid and an outlet port to return the cooling liquid back to the external liquid source. The second enclosure panel includes a liquid to air heat exchanger to cool air flowing through an air space within the fully enclosed container using at least a portion of the cooling liquid.