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US Patent 11293977 Die-to-die connectivity monitoring
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Patent
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Date Filed
March 18, 2021
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Date of Patent
April 5, 2022
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Patent Application Number
17205780
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Patent Citations
US Patent 10740262 Integrated circuit I/O integrity and degradation monitoring
US Patent 10530347 Receiver-side setup and hold time calibration for source synchronous systems
Patent Citations Received
US Patent 12072376 Die-to-die connectivity monitoring
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Patent Inventor Names
Guy Redler
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Shaked Rahamim
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Alex Khazin
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Evelyn Landman
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Eyal Fayneh
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Ishai Zeev Cohen
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11293977
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Patent Primary Examiner
Jermele M Hollington
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