US Patent 11296041 Integrated antenna package structure and manufacturing method thereof

An integrated antenna package structure including a chip package and an antenna device is provided. The antenna device is disposed on the chip package. The chip package includes a chip, an encapsulant, a circuit layer, and a conductive connector. The encapsulant at least directly covers the back side of the chip. The circuit layer is disposed under the encapsulant and electrically connected to the chip. The conductive connector penetrates the encapsulant and is electrically connected to the circuit layer. The antenna device includes a dielectric body, a coupling layer, and an antenna layer. The dielectric body has a first dielectric surface and a second dielectric surface opposite to the first dielectric surface. The coupling layer is disposed on the second dielectric surface of the dielectric body. The antenna layer is disposed on the first dielectric surface of the dielectric body. The antenna layer is electrically connected to the conductive connector. A manufacturing method of an integrated antenna package structure is also provided.