US Patent 11296424 Bump mounted radiating element architecture
Patent 11296424 was granted and assigned to Rockwell Collins on April, 2022 by the United States Patent and Trademark Office.
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US Patent 11296424 Bump mounted radiating element architecture
An antenna and manufacturing process for antennas produce radiating elements of desired size for certain frequency bands by bump mounting radiating elements to the printed circuit board substrate. Driving circuitry is stacked to save space. Also, the radiating elements are made using a different dielectric constant material as compared to the substrate. Tiling radiating elements or sub-arrays or radiating elements with bump mounting allows for spatial separation that eliminates surface waves. Bump mounted radiating elements also allow for multiple sizes of radiating elements in which smaller size provides lower directivity to cover broader beam scan performance.
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