Patent attributes
An optical module package may include a package substrate, an interposer on the package substrate, and a first semiconductor chip and a second semiconductor chip on the interposer. The interposer may include a silicon substrate having a first surface, which is adjacent to the package substrate, and a second surface, which is opposite to the first surface and adjacent to the first and second semiconductor chips, a penetration electrode penetrating the silicon substrate, a lower interconnection layer disposed on the first surface of the silicon substrate, and an optical waveguide, a first optical module, and a second optical module disposed in a lower portion of the lower interconnection layer. The first optical module may include a light source providing light into the optical waveguide, and the second optical module may include a photodetector receiving the light.
