US Patent 11305115 Percutaneous lead placement assembly
Patent 11305115 was granted and assigned to Avent on April, 2022 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
March 15, 2019
0
Date of Patent
April 19, 2022
0
Patent Applicant
Patent Application Number
16355670
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Patent Citations
Patent Inventor Names
Shyamant R. Sastry
0
Eric A. Schepis
0
Phillip A. Schorr
0
Ryan Caldwell
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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