Patent 11307689 was granted and assigned to BOE Technology Group Co., Ltd. on April, 2022 by the United States Patent and Trademark Office.
The present invention provides an array substrate. The array substrate includes: a backplane including a display area and a bonding area; a wiring layer provided on the backplane and exposed in the bonding area; a protective layer provided on a surface of the wiring layer away from the backplane and covering the wiring layer in the display area and the bonding area, wherein a through-hole is provided in the protective layer in the boding area; and a connection layer provided on a surface of the protective layer away from the backplane and coupled to the wiring layer through the through-hole.