US Patent 11309295 Semiconductor device package
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Edits on 16 Oct, 2023
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Patent Inventor Names
Wen Chieh Yang0
Wen Hung Huang0
Edits on 22 Apr, 2023
Golden AI
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Patent Jurisdiction
Patent Number
113092950
Date of Patent
April 19, 2022
0Patent Application Number
165511800
Date Filed
August 26, 2019
0Patent Citations
Patent Primary Examiner
Edits on 18 May, 2022
Golden AI
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US Patent 11309295 Semiconductor device package
Article
A semiconductor device package includes a first passive component having a first surface and a second passive component having a second surface facing the first surface of the first passive component. The first surface has a recessing portion and the second surface includes a protruding portion within the recessing portion of the first surface of the first passive component. A contour of the protruding portion and a contour of the recessing portion are substantially matched. A method of manufacturing a semiconductor device package is also disclosed.
Infobox
Is a
Patent jurisdiction
Patent number
11309295
Date of patent
April 19, 2022
Patent application number
16551180
Date Filed
August 26, 2019
Patent citations
Patent primary examiner
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