US Patent 11309337 Method of manufacturing array substrate and array substrate

A method of manufacturing an array substrate and an array substrate are provided. The method includes steps of providing a first metallic layer, a semiconductor layer, a second metallic layer, a common electrode layer, a protecting layer, and a pixel electrode layer on a substrate in sequence. The semiconductor layer is electrically connected to a source electrode of the first metallic layer through a first via hole. Part of the semiconductor layer is electrically connected to a drain electrode of the second metallic layer. A touch electrode is electrically connected to a touch signal line through a second via hole. The pixel electrode layer is electrically connected to the drain electrode through a third via hole.