Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
April 19, 2022
Patent Application Number
14648609
Date Filed
November 21, 2013
Patent Citations Received
Patent Primary Examiner
An epitaxial wafer includes an epitaxial layer disposed on a substrate. The epitaxial layer includes a first semiconductor layer disposed on the substrate and a second semiconductor layer disposed on the first semiconductor layer and having a thickness that is thicker than that of the first semiconductor layer. A surface defect density of the second semiconductor layer is 0.1/cm
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