Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
April 19, 2022
Patent Application Number
17221346
Date Filed
April 2, 2021
Patent Citations
Patent Primary Examiner
This disclosure describes systems, methods, and apparatus for multilayer superconducting structures comprising electroplated Rhenium, where the Rhenium operates in a superconducting regime at or above 4.2 K, or above 1.8 K where specific temperatures and times of annealing have occurred. The structure can include at least a first conductive layer applied to a substrate, where the Rhenium layer is electroplated to the first layer. A third layer formed from the same or a different conductor as the first layer can be formed atop the Rhenium layer.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.