Patent attributes
Radiofrequency module, including: a first layer including an array of radiating elements, each radiating element having a cross section for supporting at least one wave propagation mode, a second layer forming an array of waveguides; a fourth layer forming an array of ports; the second layer being interposed between the first and the fourth layer; each waveguide being connected to a port on the one hand and to a radiating element on the other hand for transmitting a radiofrequency signal between this port and this radiating element; the spacing between two ports being different from the spacing between the radiating elements, so that the surface area of the first layer is different from the surface area of the fourth layer; the waveguides being curved.
