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US Patent 11310592 Array microphone system and method of assembling the same

Patent 11310592 was granted and assigned to Shure on April, 2022 by the United States Patent and Trademark Office.

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Contents

Is a
Patent
Patent

Patent attributes

Patent Applicant
Shure
Shure
Current Assignee
Shure
Shure
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11310592
Date of Patent
April 19, 2022
Patent Application Number
16598918
Date Filed
October 10, 2019
Patent Citations
‌
US Patent 10153744 Automatically tuning an audio compressor to prevent distortion
‌
US Patent 10015589 Controlling speech enhancement algorithms using near-field spatial statistics
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US Patent 10021506 Adjusting the beam pattern of a speaker array based on the location of one or more listeners
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US Patent 10021515 Method and system for location estimation
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US Patent 10034116 Acoustic position measurement
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US Patent 10054320 Indoor device of air conditioner
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US Patent 10231062 Hearing aid comprising a beam former filtering unit comprising a smoothing unit
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US Patent 10244121 Automatic tuning of a gain controller
...
Patent Citations Received
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US Patent 12114118 Audio device housing
0
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US Patent 12120273 Distributed network of ceiling image-derived directional microphones
0
Patent Primary Examiner
‌
Gerald Gauthier
CPC Code
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H04R 31/00
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H04R 2201/021
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H04R 2201/40
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H04R 2201/401
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H04R 2201/405
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G06F 8/36
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G06F 8/34
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H03G 3/004
...

Embodiments include a microphone assembly comprising an array microphone and a housing configured to support the array microphone and sized and shaped to be mountable in a drop ceiling in place of at least one of a plurality of ceiling tiles included in the drop ceiling. A front face of the housing includes a sound-permeable screen having a size and shape that is substantially similar to the at least one of the plurality of ceiling tiles. Embodiments also include an array microphone system comprising a plurality of microphones arranged, on a substrate, in a number of concentric, nested rings of varying sizes around a central point of the substrate. Each ring comprises a subset of the plurality of microphones positioned at predetermined intervals along a circumference of the ring.

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