US Patent 11315830 Metallic interconnect structures with wrap around capping layers
Is a
Date Filed
January 15, 2020
0
Date of Patent
April 26, 2022
0
Patent Application Number
16743115
0
Patent Citations
Patent Inventor Names
Cornelius Brown Peethala
0
Theo Standaert
0
Kedari Matam
0
Chih-Chao Yang
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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