US Patent 11315890 Methods of forming microvias with reduced diameter
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Edits on 4 Apr, 2023
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Patent Applicant
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Patent Number
113158900
Date of Patent
April 26, 2022
0Patent Application Number
170062770
Date Filed
August 28, 2020
0Patent Citations
Patent Primary Examiner
Golden AI
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Golden AI
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Edits on 26 Sep, 2022
Golden AI
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Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
113158900
Date of Patent
April 26, 2022
0Patent Application Number
170062770
Date Filed
August 28, 2020
0Patent Citations
Patent Primary Examiner
Edits on 25 Sep, 2022
Golden AI
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US Patent 11315890 Methods of forming microvias with reduced diameter
Article
A method for forming microvias for packaging applications is disclosed. A sacrificial photosensitive material is developed to form microvias with reduced diameter and improved placement accuracy. The microvias are filled with a conductive material and the surrounding dielectric is removed and replaced with an RDL polymer layer.
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
11315890
Date of patent
April 26, 2022
Patent application number
17006277
Date Filed
August 28, 2020
Patent citations
Patent primary examiner
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