US Patent 11320733 Reticle with conductive material structure
Patent 11320733 was granted and assigned to Taiwan Semiconductor Manufacturing Company on May, 2022 by the United States Patent and Trademark Office.
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US Patent 11320733 Reticle with conductive material structure
A reticle, a reticle container and a method for discharging static charges accumulated on a reticle are provided. The reticle includes a mask substrate, a reflective multilayer (ML) structure, a capping layer, an absorption structure and a conductive material structure. The mask substrate has a front-side surface and a back-side surface. The reflective ML structure is positioned over the front-side surface of mask substrate. The capping layer is positioned over the reflective ML structure. The absorption structure is positioned over the capping layer. The conductive material structure is positioned over a sidewall surface of the mask substrate and a sidewall surface of the absorption structure.
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