US Patent 11323787 Multi-chip photonic node for scalable all-to-all connected fabrics
Patent 11323787 was granted and assigned to Hewlett Packard Enterprise on May, 2022 by the United States Patent and Trademark Office.
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Patent Number
113237870
Date of Patent
May 3, 2022
0Patent Application Number
170860440
Date Filed
October 30, 2020
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Edits on 26 Sep, 2022
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Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
113237870
Date of Patent
May 3, 2022
0Patent Application Number
170860440
Date Filed
October 30, 2020
0Patent Primary Examiner
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US Patent 11323787 Multi-chip photonic node for scalable all-to-all connected fabrics
Article
A photonic node includes a first circuit disposed on a first substrate and a second circuit disposed on a second substrate different from the first substrate. The first circuit is configured to route light signals originated from the photonic node to local nodes of a local group in which the photonic node is a member. The second circuit is configured to route light signals received from a node of an external group in which the photonic node is not a member, to one of the local nodes.
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Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
11323787
Date of patent
May 3, 2022
Patent application number
17086044
Date Filed
October 30, 2020
Patent primary examiner
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