US Patent 11324107 Panel molded electronic assemblies with multi-surface conductive contacts
Patent 11324107 was granted and assigned to Vicor Corporation on May, 2022 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
December 6, 2019
Date of Patent
May 3, 2022
Patent Applicant
Patent Application Number
16705585
Patent Citations
Patent Jurisdiction
Patent Number
Patent Primary Examiner
Find more entities like US Patent 11324107 Panel molded electronic assemblies with multi-surface conductive contacts
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
