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US Patent 11329034 Direct-bonded LED structure contacts and substrate contacts
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Patent
0
Date Filed
April 3, 2020
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Date of Patent
May 10, 2022
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Patent Application Number
16840245
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Patent Citations Received
US Patent 11652083 Processed stacked dies
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US Patent 11658173 Stacked dies and methods for forming bonded structures
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US Patent 11664357 Techniques for joining dissimilar materials in microelectronics
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US Patent 11670615 Bonded structures
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US Patent 11694925 Diffusion barrier collar for interconnects
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US Patent 11710718 Structures and methods for low temperature bonding using nanoparticles
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US Patent 11715730 Direct-bonded LED arrays including optical elements configured to transmit optical signals from LED elements
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US Patent 11749645 TSV as pad
US Patent 11756880 Interconnect structures
US Patent 11621246 Diffused bitline replacement in stacked wafer memory
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Patent Inventor Names
Cyprian Emeka Uzoh
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Rajesh Katkar
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Min Tao
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Liang Wang
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11329034
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Patent Primary Examiner
Hoai V Pham
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CPC Code
H01L 2224/83894
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H01L 2224/83895
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H01L 2224/84895
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H01L 2224/84897
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H01L 2224/8583
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H01L 2224/85895
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H01L 2224/85897
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H01L 2224/86895
0
H01L 2224/86896
0
H01L 2224/82895
0
•••
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