Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Katsuya Murakami0
Date of Patent
May 10, 2022
0Patent Application Number
168124580
Date Filed
March 9, 2020
0Patent Citations
Patent Primary Examiner
A module board of an embodiment includes a printed board having a through-hole, a semiconductor device mounted on the printed board so as to cover the through-hole, and a heat conductive polygonal column included in the through-hole. The semiconductor device includes a ground terminal or a power supply terminal, the polygonal column is supported by the through-hole at the corners of the polygonal column, and the polygonal column is connected to the ground terminal or the power supply terminal.
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