Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Navid Kazem0
Carmel Majidi0
Date of Patent
May 17, 2022
0Patent Application Number
170061110
Date Filed
August 28, 2020
0Patent Citations
Patent Citations Received
Patent Primary Examiner
CPC Code
A die of an integrated circuit and an upper layer of a circuit assembly are thermally connected by applying a thermal interface material (TIM) on the die, such that the TIM is between the die and an upper layer. The TIM comprises an emulsion of liquid metal droplets and uncured polymer. The method further comprises compressing the circuit assembly thereby deforming the liquid metal droplets and curing the thermal interface material thereby forming the circuit assembly.
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