US Patent 11335672 Semiconductor structure and manufacturing method thereof
Patent 11335672 was granted and assigned to Taiwan Semiconductor Manufacturing Company on May, 2022 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
July 23, 2020
Date of Patent
May 17, 2022
Patent Applicant
Patent Application Number
16937343
Patent Citations Received
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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