US Patent 11340466 Optical assembly for head-mountable device

Head-mountable devices can include an arrangement of components that include a waveguide that is decoupled from the ability of system loads to be transferred into the waveguide. Such decoupling can be achieved by utilizing an elastic bond with low stiffness to bond certain components together. This allows the system to flex and deform without transferring stress to the waveguide. Such decoupling can also be achieved by selectively bonding in regions that have relatively lower displacements between a support structure and the waveguide. These measures can help preserve component alignment while allowing a head-mountable device to be lightweight and small in size.